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  • Industry-Leading Size, Weight, and Power (SWaP) Consumption

    Run Prism AI and ISP on the highest-performance QCS8550 SoC in the industry

  • FUTURE PROOF YOUR DESIGN

    Flexible hardware is part of the Qualcomm Product Longevity Program

  • BUILT FOR INTEGRATORS

    Simplify development and reduce risk with Prism software and support


Introducing Prism AI


MTI & Object Detection


Counter-UAS


Fine Grained Classifier


Object Detection Air-to-Ground


Object Detection Air-to-Ground


Automotive Autonomy & AEB

Prism

The end-to-end computational imaging ecosystem supports various AI-powered object detection and tracking capabilities and advanced image processing.

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THE TELEDYNE FLIR ADVANTAGE

Integrating Teledyne FLIR thermal camera modules is now easier with our library of how-to-videos, application notes, and our comprehensive support center with product drawings, datasheets, and more!

Learn more

INNOVATE WITH THE INDUSTRY'S BEST CORES

With industry-leading reliability, performance, size, weight, and power, they are ideal for defense, commercial, and security applications.

Find out how

Prism

The end-to-end computational imaging ecosystem that supports various AI-powered object detection and tracking capabilities and advanced image processing.

Find out how

Camera Model Selector

Sorting through more than 100+ models can be tricky. Try our "Camera Model Selector" to find the right solution.

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Specifications
General
Memory
16GB LPDDR5x
Part Number
SOM 4251537
Devkit Part Number: 421-0100-00
Processor
Qualcomm QCS8550
64-bit Octa-Core
Application processor at 3.2 GHz (Gold+), 2.8GHz (4 x Gold), 2.0GHz (3 x Silver) Qualcomm Kryo CPU
Qualcomm Adreno GPU 740
Qualcomm Hexagon Tensor Processor (HTP) with Hexagon Vector eXtensions (HVX) and Hexagon Matrix eXtensions (HMX)
Qualcomm Secure Processing Unit for advanced secure use cases
Low Power AI (LPAI) subsystem with dedicated DSP and AI accelerator (eNPU) supporting always-on audio, sensors, contextual data streams, and Always-on camera.
Communication & Data Storage
Video
UHD video processing unit
AV1 decode
Native decode support for H.265 Main 10, H.265 Main, H.264 High, and VP9 profile 2
Native encode support for H.265 Main 10, H.265 Main, H.264 high formats
Mechanical
Dimensions
SOM Board: 40.27 x 33.41 mm LGA form factor
Weight
5 grams (without shield)
Other
Operating Environment [OE]
Input Voltage: 3.6V Operating Temperature: -20 to +60 °C
Operating System [OS]
OS - Linux LE (r76)
Storage
Storage
256GB UFS 3.1
Media gallery
Deploying AI Object Detection, Target Tracking, and Computational Imaging on Embedded Processors
Maximize Perception with Prism ISP and AI Tools for Enhanced Thermal Imaging | SPIE DCS 2024
Related Documents
Export Restrictions

Export Restrictions

The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.

FLIR AVP