SWIR FPAs

• Proven Performance and Reliability for Research, Industrial and Military Applications
• High-Sensitivity Indium Galium Arsenide (InGaAs) Detectors
• Mid Format 320 x 256 with 30-micron Pitch
• User-Configurable Operational Modes
• Industry Standard Device

FLIR Systems Inc., the premier supplier of infrared products, offers the ISC9809 based Indium Gallium Arsenide (InGaAs) focal plane array, packaged as a sensor assembly. These commercial off-the-shelf staring focal plane arrays (FPAs) are based on our InGaAs detectors and advanced readout integrated circuit (ROIC) technology. 

FLIR FPAs and sensor assemblies are available in mid format, 320 x 256 pixel arrays. Short-wave InGaAs FPAs cover the 0.9 to 1.7 µm spectral range. FPAs are hybrid assemblies that are mounted on 84-pin leadless chip carriers, customer supplied substrates, or integrated into packaged sensor assemblies.

These arrays utilize a capacitive transimpedance amplifier circuit design, optimized for a wide range of applications, including those with low signal levels. All designs include two operation modes — a simplified default mode and a user configurable command mode — which provide the flexibility necessary to support a wide range of applications. From terrestrial applications that use a single channel video rate output, to high-speed scientific laser testing where multiple outputs and dynamic windowing are needed — FLIR focal plane arrays surpass the requirements. The windowing feature allows two-dimensional sub-arrays to be read out at frame rates of up to 38,000 frames per second for small window sizes. Other advanced on-chip features of the ROIC include integration capacitor selection, variable gain, multiple output channels, snapshot integration with variable integration time settings, signal skimming, non-destructive readout, and dynamic image transposition. The detector bias setting and overall power control for the chip are also user-adjustable.

Focal plane arrays are typically packaged in 84-pin leadless chip carriers and are wire-bonded and fully tested to meet the listed specifications. A wire-bonding diagram and interface documentation are delivered as part of the standard product offering. Volume customers have the option of supplying their own substrates for FPA mounting, conditional on advance approval.

Sensor assembly packaging is available for mid format InGaAs FPAs. These assemblies consist of one FPA mounted on a thermoelectric cooler (TEC) and are integrated into a FLIR designed dewar, which is powered through pins on the rear side of the assembly. The system f-number is set by the higher level system optical path. The front window of the dewar is BK7A glass and transmits radiation in the 0.9 to 1.7 µm range; it is canted and coated for minimizing reflections. The window and package opening are sized so as not to vignette the FPA when used with f/1.4 or slower optics. The average window transmittance (at 1.0 µm) is greater than 99%, with less than 0.1% reflectance at 1.55 µm.

The back of the mid format ISC9809 package supplies the 41-pin electrical interface to the assembly. An interface description document describes this interface and is provided as part of standard delivery.