Sensor Assemblies

Sensor assembly packaging is available for mid- format InGaAs FPAs. These assemblies consist of one FPA mounted on a thermoelctric cooler (TEC) and are integrated into a FLIR designed dewar, which is powered through pins on the rear side of the assembly. The system f-number is set by the higher level system optical path. The front window of the dewar is BK7A glass and transmits radiation in the 0.9 µm to 1.7 µm waveband range; it is canted and coated for minimizing reflections. The window and package opening is sized so as to not vignette the FPA when used with f/1.4 or slower optics. The average window transmittance (at 1.0µm) is greater than 99.5%, with less than 0.1% reflectance at 1.55 µm.

The back of the mid format ISC9809 package supplies the 41-pin electrical interface to the assembly. An interface description document describes this interface and is provided as part of standard delivery.