Sensor Assemblies

Sensor assembly packaging is available for mid-format InGaAs FPAs. A sensor package consists of a SWIR FPA mounted on a thermoelectric cooler (TEC). The FPA and TEC are integrated into a FLIR-designed vacuum package assembly (VPA). The VPA is powered via pins on the back side of the assembly. The system f-number is set by the higher level system optical path.

The front window of the dewar is BK7A glass and transmits radiation in the 0.9 µm to 1.7 µm waveband range; it is canted and coated for minimizing stray light reflections. The window and package opening is sized so as to not vignette the FPA when used with f/1.4 or slower optics. The average window transmittance (at 1.0µm) is greater than 99.5%, with less than 0.1% reflectance at 1.55 µm.

An electrical interface description document (EIDD) describes the 41-pin electrical connection of the VPA. The EIDD is available to qualified VPA customers.