Thermal Imaging for Engineering

IR cameras made by FLIR have become indispensible tools for many engineering disciplines, particularly in product development. A prime example is making sure that products do not have excessive heat dissipation that would shorten their useful lives. This applies to both electrical and mechanical components and assemblies.

Infrared analysis of printed circuit boards makes it easier to detect and diagnose problems.

Shorter the time to market

Studying the heat generation and dissipation of a product at its early stage of development reduces the design iterations and therefore dramatically shorten the time to market of a product. Products are better designed and optimized improving their reliability, safety and cost. Almost all type of product gets benefit of thermal analysis done by infrared images, from tires to complex electronic assembly, from low cost to high technology devices.

Thermal behaviour over time

Infrared cameras from FLIR allow measuring a steady temperature pattern as well as thermal evolution over time, even as fleeting as a spark or air bag deployment. Powerful but comprehensive software, which gives access to extended analyses and reporting tools, improves the communication across the different teams.

Stress field measurement

Because of its unique capability of acquiring a thermal snapshot of a material, it is possible to actually see its thermo mechanical properties. It is very useful to evaluate the amount of stress that a mechanical part has to support and then optimize its design to improve its reliability. The fatigue of the material can also be measured allowing predicting much before it occurs where the part will break. The automotive industry takes a dramatic advantage of these possibilities.