Hadron™ 640R pairs a performance-leading 640x512 resolution radiometric Boson® thermal camera with a 64MP visible camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where battery life and run time are mission critical. The Boson longwave infrared (LWIR) thermal camera provides the ability to see through total darkness, smoke, most fog, glare as well as take the temperature of every pixel in the scene. The 64MP visible camera imagery enables AI and machine learning for intelligent sensing applications. With drivers available for market leading processors from NVIDIA, Qualcomm, and more plus industry-leading integration support, Hadron 640R reduces development cost and shortens time to market.
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- Hadron™ 640R
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Size, Weight, and Power Optimized Design
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Industry-Leading Thermal and Visible Camera Performance
Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.
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Built for Integrators
Reduce development cost and time to market with a solution from a single, reliable supplier.
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Optimize design and operation time with compact, lightweight, and low-power module.
The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ LWIR camera portfolio.
Integrate Thermal Faster
Maximize efficiency with the NEW Hadron 640R Development Kits. The new development kits enable integrators to start imaging with the SWaP-optimized Hadron 640R radiometric thermal and visible cameras within just hours using the NVIDIA Jetson Nano, the Qualcomm RB5, and the Qualcomm 865.
Specifications
- Thermal Imaging Detector
- Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
- Temperature Accuracy
- ±5°C less, over 0°C to 100°C range.
Radiometry
- Temperature Accuracy
- ±5°C less, over 0°C to 100°C range.
Imaging & Optical
- EO Camera Optics
- Effective Focal Length (EFL) 4.8 mm, 67° HFOV, F/# 1/2.3
- EO Camera Sensor
- 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
- EO Camera Video
- Full resolution @ 60 Hz
- IMU
- ICM20602, I2C or SPI (selectable)
- IR Camera Optics
- Effective Focal Length (EFL) 13.6mm, 32° HFOV, F/# 1.0
- IR Camera Video
- Full resolution @ 60Hz
- Thermal Imaging Detector
- Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
Connections & Communications
- Software Drivers
- NVIDIA Jetson Nano
Qualcomm Snapdragon rb5
Qualcomm Snapdragon 865
*Contact Teledyne FLIR for latest software drivers
Electrical
- Electrical Interface
- Hirose DF40C-50DP-0.4V (51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V (51)
- Power
- 5V, typical power dissipation <1800 mW, Max <2900 mW
Mechanical
- Mechanical Interface
- Screw mount to back plate
- Size (w/o lens)
- 35 x 49 x 45 mm (1.38” x 1.93” x 1.77”)
- Weight
- 56 g
Environmental & Approvals
- Environmental Sealing
- IP54 (with the rear interfaces sealed)
- Operational & Storage Temperature
- -20°C to +60°C
- Tested EMI Performance
- FCC part 15 Class B
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Export Restrictions
Export Restrictions
The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.